HERCULES® Lithography Track System

For fully automated and integrated coating, mask alignment, exposure and/or developing.


  • Max. wafer size: 300 mm
  • Max. square substrate size (edge length): 300 mm
  • Max. number of spin modules (coat/develop): 4
  • Max. number of further modules (hot plates, chill plates, vapor prime): 24
  • Bridge Process Capability:
    • Option 1: 50 mm - 200 mm
    • Option 2: 200 mm - 300 mm
  • Spray coating:
    Spray nozzle programmable parameters: Speed (rpm), acceleration (rpm/s), absolute position
    Park position (nozzles sealed) and dummy dispense
  • Spin coating:
    CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity
    Drive unit up to 10,000 rpm, ramp-up speed up to 40,000 rpm/s
    Park position (nozzles sealed) and dummy dispense
  • Developing:
    Pressurized tank, flow control
    Nitrogen nozzle for atomizing developer in spray mode; also suitable for puddle and stream (rinse) develop
    Park position and dummy dispense
  • NanoSpray:
    For coating vias with Ø down to 20 µm and aspect ratios up to 1:4 and more;
    Sidewall angle can be vertical.
  • Max. hotplate temperature: 350 °C
  • Automation options:
    Resist pumps for spin coating:
    - For resist viscosities up to 52,000 cP
    - Up to 15 ml dispense volume, up to 5 ml/s dispense rate
    - Suckback programmable for best uniformity
    Resist pumps for spray coating:
    - Precise flow control 10 µl/s up to 200 µl/s for low-viscosity resist