HERCULES® Lithography Track System

For fully automated and integrated coating, mask alignment, exposure and/or developing.

 

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system. It utilizes cassette-to-cassette handling systems to efficiently process wafers from 50 mm to 200 mm (or 200mm and 300 mm) in diameter. The Hercules safely handles thick, bowed or small diameter wafers. Precision top and front to backside alignment as well as coating of sub-micron to ultra-thick (up to 300 microns) resists can be applied for interlayer and passivation applications. The superior alignment stage design achieves highly accurate alignment and exposure results for high throughput. 

Features

  • Production platform which offers all combined advantages of EVG's precision alignment and resist processing systems in a minimized footprint production solution
  • Fully integrated tool for coating, mask alignment, exposure and/or developing
  • Wafer processing with high throughput and reduced manpower
  • Substrate handling by robots
  • Alignment with EVG IQ Aligner or EVG6200 alignment systems
  • Chemistry handling in separate cabinet
  • Spin and/or spray coating
  • Soft bake, prebake, vapor prime and/or wafer cooling
  • Exposure with lamp house up to 5kW
  • Post exposure bake
  • Development
  • Ergoload cassette stations or SMIF Pods / FOUPs
  • Coating of sub-micron to ultra-thick (up to 300 microns)
  • Options:
    - OmniSpray® coating for optimized coating of high topography surfaces
    - Handling of thick, bowed or small diameter wafers
    - Handling of ultrathin and fragile substrates
    - Nanospray
    - Automated mask handling