EVG®40 Semi-automated Top-to-bottom side Measurement System

For top-to-bottom side alignment accuracy measurement.

 

  • Substrate parameters:
    Substrate size: up 200 mm
    Substrate thickness: Max. 10 mm
  • Alignment stage:
    Chuck alignment stage: Y: ± 5 mm,  X: ±105 mm
  • Measurement accuracy: 
    < 0.5 µm  (99% of measurements will be no more than +/-0.5 µm from the true value)
    Specification for 20x objectives and good contrast alignment keys
  • Automatic measurement: Image recognition system (optional)
  • Handling system: Three-axis robot, send, receive and reject cassettes, 100 - 150 mm wafers
  • Robot accuracy: ± 50 µm, ±0.1°
    Accuracy of prealignment station:  X: ± 50 µm, Y: ± 50 µm, Theta: ± 0.09°
  • Microscope:
    Objectives:  5x, 10x, 20x
    Camera: High resolution BW-CCD camera; displayed in software window