EVG®40 Semi-automated Top-to-bottom side Measurement System

For top-to-bottom side alignment accuracy measurement.

 

The EVG40 Semi-automated Top-to-bottom side Measurement System performs precision destruction-free top-to-bottom side alignment accuracy measurement of double-sided structured wafers. The EVG40 can accurately measure any type of substrate material up to 200 mm in size. With its flexibility it is suitable for different fields of applications like MEMS, sensors, micro-optics, power devices, compound semiconductors and silicon-based power devices, hybrid technology, multi-layers and all technologies that involve double-side lithography

Features

  • Highly accurate, destruction-free alignment accuracy measurement of
    double-sided structured wafers
  • Repeatable top to bottom side alignment accuracy measurement
  • Non-destructive, visible light, self calibrating technology
  • PC-based measurement system
  • Line Width measurement
  • Infrared measurement
  • Option: Handling system for fully automated high throughput operation