EVG®101 Advanced Resist Processing System

Single wafer processing in R&D and small scale production.

 

Brochures
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EVG100 Series Short Brochure.pdf




Technical Papers
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Adhesive wafer bonding for MEMS applications
Abstract: Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding....



Adhesive wafer bonding for wafer-level fabrication of microring resonators
Abstract: Adhesive wafer bonding for wafer-level fabrication of microring resonators Abstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration concept with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.



Adhesive Wafer Bonding With SU-8 Intermediate Layers For Micro-Fluidic Applications

Abstract: Recently adhesive wafer bonding using SU-8 has gained a lot of interest for micro-fluidic devices e.g. lab-on-chip applications. Due to its specific properties as well as the capability to pattern thin and thick layers accurately, SU-8 is an ideal candidate for micro-fluidic components like channels, reservoirs and valves, but also for micro-optical components...



An ultra-thick positive photoresist for advanced electroplating applications
Abstract: Flip chip packaging has been adopted for microprocessors and high-performance logic for performance reasons. Over time, flip chip is increasingly being adopted by lower transistor count devices for cost savings as flip chip packaging reaches cost parity with wire bonding in many applications...



Fabrication of 3D-photonic crystals via UV-nanoimprint lithography
Abstract: Optical lithography will reach its limits due to the diffraction effects encountered and the necessity for using complex resolution enhancement techniques like optical proximity correction (OPC), phase shift masks (PSM) and off-axis illumination [1]. The restrictions on wavelength, in combination with high process and equipment costs make low cost, simple imprinting techniques competitive with next generation lithography methods...



Fabrication of 3D-photonic crystals via UV-nanoimprint lithography
Abstract: The restrictions on wavelength, in combination with high process and equipment costs make low cost, simple imprinting techniques competitive with next generation lithography methods. There are several Nanoimprint Lithography (NIL) techniques which can be categorized depending on the process parameters and the imprinting method – either step and repeat or full wafer single step imprinting...



Investigating the use of spray-coating technology in MEMS applications
Abstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....



Microring resonators fabrication by BCB adhesive wafer bonding
Abstract: Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding...



Spray coating for MEMS, NEMS and Micro Systems
Abstract: In the semiconductor and MEMS industry there is a requirement for uniform resist layers over highly integrated device structures. To achieve a precise line width, it is required to develop a coating process in which there are no coating defects, high coating uniformity over structures, and little to no edge bead...



Ultra-thick lithography for advanced packaging and MEMS
Abstract: An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging.  Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures... 



Wafer level packaging on Cu/low-K, high density back-end integrated circuits
Abstract: The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. Wafer level packaging is a promising technology to meet future demands of increase performance for advanced integrated circuits with tighter pitch (higher feature density) higher I/O counts and Cu metallization with low-k dielectric layers...



Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging
Abstract: IC performance is drastically limited by line-to-line capacity coupling and RC interconnect delay times resulted from the continuous increase in integration densities with 0.10µm line and space width approaches, as well from increased signal frequencies. The new achievements in terms of circuit lines shrinkage emphasize the need for the introduction of Cu and low-k dielectric materials...  

III-V wafer bonding technology for wafer-level fabrication of GaInAsP/InP microring resonators
Abstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration conecpt with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.