Technical
Papers
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Fabrications of
micro-channel device by hot emboss and direct bonding of
PMMA
Abstract: We have fabricated and evaluated the mechanical,
optical and fluidic characteristics a 50um wide and a 30um deep
micro-channel device produced by hot emboss and direct bonding of PMMA
plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel
device was evaluated the bond strength, which was confirmed to be high
enough for practical use as well as for quite severe cleaning conditions as
ultrasonic cleaning in pure water...
Impact of
vacuum environment on the hot embossing
process
Abstract: One of the key
questions concerning the concept of a system for hot embossing
lithography is whether or not it should provide for imprinting under
vacuum. We have performed experiments comparing the embossing in vacuum
and in atmospheric pressure in a semi-automated imprint system. The
stamps used were fully patterned, 10cm diameter with pattern sizes
ranging from 400nm to 100µm...
Nanoimprint
lithography a next generation high volume lithography
technique
Abstract: Nanoimprint Lithography has been demonstrated to
be one of the most promising next generation techniques for large-area
structure replication in the nanometer scale. This fast and low cost method
becomes an increasingly important instrument for fabrication of
biochemistry, µ-fluidic, µ-TAS and telecommunication devices, as well as
for a wide variety of fields in the nm range, like biomedical,
nano-fluidics, nano-optical applications, data storage, etc...
Nanoimprint
lithography - full wafer replication of nanometer
features
Abstract: Nanoimprint Lithography (NIL) is a fast, high
resolution replication technology for micromechanics, microbiology and even
for microelectronic applications in the sub-100nm range. The technique has
been demonstrated to be a very promising next generation technique for
large-area structure replication up to wafer-level in the micrometer and
nanometer scale...
Nanoimprint
lithography with a commercial 4”-bond system for hot
embossing
Abstract: In order to examine the suitability of
nanoimprinting for wafer scale pattern definition, a commercially available
hot embossing system, the EV520HE of EVGroup, Austria, has been used to
imprint 4 inch substrates. The EV520HE is based on a production-proven
wafer bonding system which guarantees compatibility with semiconductor
fabrication conditions...
Nanostructuring
of polymers by hot embossing
lithography
Abstract: While
researchers of ever more advanced NGL systems are still struggling to
demonstrate the feasibility to manufacture features well below 100 nm at
an affordable cost and a reasonable throughput, nanoimprint technologies
are emerging as a possible answer to these challenges. 100 nm patterns
are imprinted with a fully patterned 4 inch diameter stamp in a
low-temperature embossing process...
One micron
precision optically aligned method for hot-embossing and
nanoimprinting
Abstract: This paper reports an optically aligned
hotembossing and imprinting method for biomedical, microfluidic, and
microoptical sensors. Hot-embossing technology is a low cost, flexible
fabrication method, which has demonstrated high aspect ratio polymer
microstructures as well as nanoimprinting patterns. It uses polymer
substrates to imprint a pattern created on a master stamp...
Transition of MEMS
technology to nanofabrication
Abstract:
The transition of MEMS technology to nano fabrication is a solution to the
growing demand for smaller and high-density feature sizes in the nanometer
scale. Techniques for fabricating µm-, and nm-features will be discussed,
and results achieved with nanoimprinting technologies will be
presented...