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  • EVG®520HE

EVG®520HE Semi-Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

Overview Technical Data Gallery Downloads

 

  • Stamper/substrate size: up to 200 mm diagonal
  • Stack thickness:  max. 15 mm
  • Contact force:  40 kN, 60 kN
  • Temperature up to 550°C
  • Temperature stability: ± 1 %
  • Temperature uniformity: ± 1.5 %
  • Vacuum capability: down to 10-5 mbar

 

Produkte

  • Lithographie
    • Mask Alignment Systems
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      • EVG®620
      • EVG®6200∞
      • IQ Aligner®
      • EVG®770
      • EVG®510HE
      • EVG®520HE
      • EVG®750
    • Inspektionssysteme
  • Bonding
  • Prozesstechnologie
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VLSIresearch kürt "THE BEST 2013 Suppliers"

VLSIresearch verkündet Gewinner der Auszeichnung "10 BEST Suppliers of Chip Making Equipment"

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ECTC 2013

sensors expo & conference 2013

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See Also

Related Markets

Nanotechnologie

EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology

Technische Publikationen

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

EV Group HR Video

References


Consortium for Commercialization of Nano Imprint Lithography (NIL)

 
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