EVG®750R2R Automated Hot Embossing System

EVG750R2R

 

Foil Handling Units:

  • Speed: 0.5 m/min up to 20 m/min
  • Foil width: 300 mm
  • Foil thickness: 50 µm up to 1000 µm
  • Winding weight: < 100 kg
  • Materials: PC, PMMA, PET, PS

 

Unwind - Rewind Unit:

  • Winding accuracy: < 100 µm  
  • De-ionizer: 2 de-ionizers after protective film removal and embossing 
  • Splicing Table: For integration of polymer films in sheet format on unwind and rewind unit
  • Protective film removal: Integrated on unwind unit
  • Tension control: Active tension control
  • Speed control: Active speed control and feedback to rewind unit


Embossing Unit:

  • Imprint Force: up to 10 kN
  • Heating: Up to 200 °C
  • Cooling: Immediate cooling after embossing
  • Structure size: From < 50 nm up to several 100 µm
  • Optical sensor for splice detection: Integrated on embossing unit
  • Rotary encoder: Rotational adjustment of stamp and substrate position