EVG®520HE Semi-Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

The EVG520HE Semi-automated Hot Embossing System is designed for embossing and nanoimprinting applications. This production-proven system from EVG accepts substrates up to 200 mm and is compatible with standard semiconductor manufacturing technologies. The hot embossing system is configured with a universal embossing chamber, high-vacuum and high-contact force capabilities and manages the whole range of polymers suitable for hot embossing. Together with high-aspect ratio embossing and multiple de-embossing options many processes for high quality pattern transfer and nm resolution are offered.

Features

  • For hot embossing and nanoimprinting applications of polymer substrates and spin-on polymers
  • Automated embossing process
  • EVG's proprietary separate alignment process for optically aligned embossing and imprinting
  • Pneumatic de-embossing options
  • Software controlled process execution
  • UV-NIL Option