EVG®510HE - Semi-automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

 

  • Stamper/substrate size: up to 150 mm diagonal
  • Contact force: up to 10 kN
  • Stack thickness:  max. 15 mm
  • Vacuum capability down to 0.1 mbar (10-3mbar, 10-5 mbar optional) 
  • Temperature: up to 300°C
  • Independent temperature control of top and bottom heaters
  • Temperature stability: ± 1 %
  • Temperature uniformity: ± 1.5 %
  • Rapid cooling procedure
  • Precise temperature control
  • Excellent temperature uniformity