IQ Aligner® Automated Mask Alignment System

Optimized for contactless proximity processing at highest throughput. Most accurate print gap control and unmatched uptime are fully addressing HVM requirements.

Overview Technical Data Gallery Downloads Videos

Substrate / Wafer parameters:
Size: 150mm, 200mm, 300mm; Thickness: 0.1 - 15mm
Mask parameters: Size: max. 14"x14"; Thickness: <13mm
General system configuration:
System rack: standard; Vibration isolation: active
Alignment accuracy:
Top side alignment: ± 0.5µm 3σ
Bottom side alignment: Option / ± 0.75µm 3σ
IR alignment: Option / substrate depending
Large gap alignment: Option / ± 1µm 3σ
Bond alignment: Option
NanoAlign: Standard
Alignment stage:
Precision micrometers: Motorized
Wedge compensation: Internal 0.5 - 100N contact force,
proximity spacers (option), 100% contactless (option)
Exposure:
Modes: Proximity, soft-, hard, and vacuum contact
Resolution: <1µm in vacuum contact, </= 2µm in proximity
Wave length: 200 - 240nm / 240 - 280nm / 280 - 350nm / 350 - 450nm, filters (option)
Mercury arc lamp: 500 / 1000 / 5000W
Nanoimprint lithography: Optional tools available for UV-Nanoimprint Lithography and micro contact printing to achieve sub 100nm features
Automatic alignment: Option
Handling system: 3 cassette stations (up to 200mm) or 2 FOUP load ports / 300 mm
Automatic mask loading: Option
SECS/GEM II: Option
Lithography Track System Hercules: up to 300 mm

Produkte

Suche nach Produkten

News und Events

VLSIresearch kürt "THE BEST 2013 Suppliers"

VLSIresearch verkündet Gewinner der Auszeichnung "10 BEST Suppliers of Chip Making Equipment"

weitere News ..

ECTC 2013

sensors expo & conference 2013

weitere Events ..