Based on the highly successful and field-proven EVG620, the HBL-version is optimized for lowest cost-of-ownership and highest yield in compound semiconductor manufacturing. Continuous processing of up to 165 wafers, highest alignment accuracy and the capability to handle bowed, warped and transparent substrates such as sapphire, SiC, AlN, metallic or ceramic substrates with sizes up to 150 mm make the EVG620HBL the perfect solution for high volume manufacturing of HB-LEDs and compound semiconductors.
Features
Dedicated mask alignment system for HB-LEDs
Supporting wafer sizes up to 150 mmUp to 220 wafers per hour in first print mode with highest throughput design*Up to 165 wafers per hour throughput including automatic alignment*Superior automatic alignment software supporting synthetic pattern training and automatic origin setting and centeringRecipe controlled microscope illumination spectrum for best pattern contrast with various wafer and layer materials
Fully automated system for high volume manufacturing
5 send and receive cassette stationsHigh intensity UV-light source configuration for shortened process timeEnhanced lamp power controller with automatic lamp cooling control for reduced maintenance timeSmall footprint and minimized facility requirements for optimized cost of ownership
EVG's field proven mask alignment technology
Separate adjustable wafer contact force for wafer wedge compensation and contact exposure besides proximity exposure capabilitySub-minute tool conversion time for different substrate sizesDesigned according to Semi S2 (Safety) and Semi S8 (Ergonomics); NTRL listed
Total solution for HB-LEDs
Field-proven equipment for high volume manufacturingWorldwide process engineering supportWorldwide customer support
*5 cassette continuous operation equivalent, optimized process parameters