EVG®610 Semi-automated Mask Alignment System
Mask aligner designed for optical double-side lithography. Dedicated for R&D and small-volume applications.
- Wafer diameter (Substrate size / mm):
Pieces up to 200 mm, 150 mm x 150 mm - Max. mask size: Up to 9" x 9"
- Alignment modes:
Top side CCD: Up to
± 0.5
µ m / 3
σ
Top side with eye pieces: Option
Bottom side: Option
Transmissive IR: Option
Reflective IR: Option
Bond alignment: Option
NIL and Micro contact printing: Option
Insitu alignment verification: Option - Stage:
Precision micrometers: Manual
Contact force Adjustable: 5N - 80N - Exposure
Modes: Proximity, soft-, hard- and vacuum contact
Resolution: <0.8
µ m in vacuum contact,
≥ 2
µ m in proximity
Wave length: 200 - 240 nm / 240 - 280 nm / 280 - 350 nm / 350 - 450 nm, filters (optional)
Mercury arc lamp: 350 / 500W NUV; 500W DUV - Nanoimprint Lithography (NIL)
Hard Stamp: 1" x 1" active imprint are,
≤ 50 nm pattern resolution and alignmen down to
± 0.1
µ m / 3
σ
Soft stamp: Up to 150 mm active imprint area,
≤ 50 nm pattern resolution - Typical customer application: R&D / Pilot line production