With up to four spin modules and a cassette-to-cassette handling system,
the EVG150 allows for a fully-automated coat/develop process and
high-thoroughput performance. Along with high spin speeds and coating
chambers with closed lids, the EVG150 produces highly uniform coats and
improves repeatability to suit these needs. Wafers with high topography can
be uniformly coated by OmniSpray® technology, where traditional
spin coating encounters limitations.
Features
- Spinner modules for coating (spin/spray) or developing
- Bake modules
- Chill modules
- Cost effective system for optimized production
- Sophisticated field-proven wafer handling by robot
- System customized for best benefit, including tooling (chucks),
handling
(robot endeffector, pre-aligner) and modules
-
Options
- OmniSpray® coating for
optimized coating of high topography surfaces
- Temperature controlled resist & developer lines
- Bake modules for up to 350 °C
- Vapor prime
- Handling of thick, bowed or small diameter wafers
- Handling of ultrathin and fragile substrates
- SMIF Input output modules (for 150 + 200 mm)
- FOUP load ports (for 200 + 300 mm)