EVG®120 Automated Resist Processing System

Compact, cost effective system for start of production and limited cleanroom space.

Max. wafer size: 200 mm
Max. number of spin modules (coat/develop): 2
Max. number of further modules (hot plates, chill plates, vapor prime): 10
Spray coating:
Spray nozzle programmable parameters: Speed (rpm), acceleration (rpm/s),
absolute position
Park position and dummy dispense
Spin coating:
Drive unit up to 10.000rpm, ramp-up speed up to 40.000 rpm/s
Park position and dummy dispense
Developing:
Pressurized tank, flow control
Nitrogen nozzle for atomizing developer in spray mode; also suitable for puddle
and stream (rinse) develop
Park position and dummy dispense
Max. hotplate temperature: 250 °C
Automation options:
Resist pumps for spin coating:
- For resist viscosities up to 50000cP
- Up to 15ml dispense volume, up to 5ml/s dispense rate
- Programmable suckback for best uniformity
Resist pumps for spray coating:
- Precise flow control 10µl/s up to 200µl/s for low viscosity resist

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