EVG®560HBL Fully Automated Wafer Bonding System for HB-LED

Configurable for all wafer bonding processes such as eutectic, thermo compression, fusion bonding, or LowTemp plasma bonding.

 

Brochures
Please click the picture to download the brochure in PDF format

                  
EVG560 HBL Product News.pdf 
                        HB-LED Short Brochure.pdf