EVG®560 Automated Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

 

The EVG560 Automated Wafer Bonding System accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

Features

  • Fully-automated processing with automated loading and unloading of bond chucks
  • Up to four bond chambers for various bonding processes
  • Automatic loading and unloading of bond chambers and cooling station
  • Remote modem diagnostics