EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System

For permanent bonding on chips to wafer (C2W) on wafer scale.

 

  • Heater size = Max. wafer diameter: 150 mm, 200mm, 300mm
  • Min. wafer diameter: 150mm heater: 50mm; 200mm heater: 100mm, 300mm heater: 200mm
  • Bond chuck system / Alignment system: Device bonder such as Datacon Device Bonder
  • Max. contact force: 3.5kN, 7kN, 10 kN, 20 kN, 40 kN, 60 kN
  • Max. temperature: up to 300°C
  • Vacuum: 1E-3 mbar (standard), 1 E-5 (optional), vacuum controller and process gas lines optional
  • Loading chamber: 3-axis robot
  • Process (recipe) compatible with GEMINI
  • Max. number of bond chambers: 1
  • Customer / application: pilot-line +manufacturing, high volume manufacturing