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  • EVG®540

EVG®540 Automated Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

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News und Events

EV Group bringt neue Generation des EVG120 Automated Resist Processing Systems auf den Markt

EV Group liefert 300mm Wafer Bonding System an führende chinesische Halbleiter-Foundry

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ECTC 2013

sensors expo & conference 2013

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See Also

Related Markets

EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS

EV Group erweitert Wafer Bonding Equipment- und Prozess-Lösungen um Covalent Bonding Technologie

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EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

EV Group HR Video

References

waferbonder.com

 
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