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  • EVG®540

EVG®540 Automated Wafer Bonding System

Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

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VLSIresearch verkündet Gewinner der Auszeichnung "10 BEST Suppliers of Chip Making Equipment"

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Related Markets

EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS

EV Group erweitert Wafer Bonding Equipment- und Prozess-Lösungen um Covalent Bonding Technologie

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References

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