Configurable for all wafer bonding processes such as anodic, thermo
compression, fusion bonding, or LowTemp plasma bonding.
The EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications. Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems.
- Fully-automated processing with automated loading and unloading bond chucks
- Single chamber production bonder
- Automatic handling of up to four bond chucks
- Compliant to high safety standards
- Modular bond chamber design
- Active bottom side cooling