The EVG520L3 equipment name extension L3 stands for Linear Load Lock. It features the capability of separating process steps in order to gain throughput and improve process capabilities, especially for high vacuum bonding applications. Furthermore the system includes up to 100kN high force bonding capability. Due to its pre-processing chamber and the transfer system between chambers the EVG520L3 is capable of executing processes under high-vacuum, since substrate will not get in contact with surrounding environment.
Unique Features
- Separated process chambers for high throughput
- High piston force (100kN) capability
- 3 chambers (pre-heat, bond, cooling)
- Transfer under high vacuum condition (1x10
-3 mbar)
- High vacuum capability in bond chamber (low 10
-6 mbar range)
- Simultaneous processing of 3 bondchucks