The EVG520IS single-chamber unit handles wafers up to 200 mm with
semi-automated operation for small volume production applications.
Redesigned based on customer feedback and EV Group's continuous
technological innovations, the EVG520IS features EV Group's proprietary
symmetric rapid heating and cooling chuck design. Advantages such as
independent top and bottom side heater, high pressure bonding capability
and same material and process flexibility as on manual systems contribute
to the success of all wafer bonding processes.
Features
- Fully-automated processing with manual loading and unloading including
external cooling station
- Single or double chamber automated system
- Fully automated bond process execution and bond cover movements
- Multi-stack bonding options
- Integrated cooling station for high throughput
- Options:
- Turbo molecular pump
- High vacuum capability
- Programmable mass flow controller