EVG®820 Lamination System

For punching and lamination of dry adhesive tape on carrier wafer.

 

Brochures
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EVG_TempBonding_Debonding_ShortBrochure.pdf


Technical Papers
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Adhesive Wafer Bonding With SU-8 Intermediate Layers For Micro-Fluidic Applications
Abstract: Recently adhesive wafer bonding using SU-8 has gained a lot of interest for micro-fluidic devices e.g. lab-on-chip applications. Due to its specific properties as well as the capability to pattern thin and thick layers accurately, SU-8 is an ideal candidate for micro-fluidic components like channels, reservoirs and valves, but also for micro-optical components...



High temperature–resistant spin-on adhesive for temporary wafer mounting using an automated high-throughput tooling solution
Abstract: Myriad structures for stacking chips, power devices, smart cards, and thin substrates for processors have one thing in common: thin silicon. Wafer thinning will soon be an essential process step for most of the devices fabricated and packaged henceforth. The key driving forces for thinned wafers are improved heat dissipation, three-dimensional stacking, reduced electrical resistance, and substrate flexibility...



High-performance temporary adhesives for wafer bonding applications

Abstract: This paper reviews a high temperature–resistant spin-on adhesive platform and the equipment solution used to apply the adhesive to a wafer, temporarily bond the wafer to a carrier, and debond the thinned wafer in an automated high-throughput method. The focus of this paper is on the physical and chemical properties of the spin-on adhesive material that enable an automated process...



Production proven temporary bonding and de-bonding equipment and technology
Abstract: The utilization of compound semiconductor materials has been steadily increasing, especially in the optoelectronics industry. Application of these materials typically requires the substrates to be greatly thinned below 100µm prior to packaging. Due to the fragility of these substrate materials, some form of support is required for handling throughout the various process steps...



Reversible wafer bonding for reliable compound semiconductor processing
Abstract: Reversible wafer bonding is a process enabling reliable compound semiconductor wafer handling for multi-step processes including photolithography, thinning, etching or coating. Two processes using wax and dry film adhesives are presented in this paper.