SOI wafers are a promising new basic material for the microelectronics
industry to produce faster and higher performance microelectronic devices.
Wafer bonding, as one key enabling technology for the SOI wafer fabrication
process, achieves high quality single crystal silicon films on insulating
substrates. With the EVG850 SOI production bonding system, all essential
steps for SOI bonding from cleaning and alignment to pre-bonding and
IR-inspection are combined. Thus, the EVG850 assures a high-yield
production process for void-free SOI wafers up to 300 mm sizes. Being the
only production system built to operate in high-throughput, high-yield
environments, the EVG850 has been established as the industry standard in
the SOI wafer market.
Features
- Production system built to operate in high-throughput, high-yield
environments
- Automated cassette-to-cassette or FOUP-to-FOUP operation
- Contamination-free backside handling
- Megasonic and/or brush cleaning
- Pre-bonding with mechanical flat or notch alignment
- Advanced remote diagnostics