EVG®320 Automated Single Wafer Cleaning System

Designed for efficient removal of particles.

 

  • Wafer size: 50mm - 200mm, 100mm - 300mm
  • Cleaning system: open chamber, spinner and cleaning arm
    Chamber: made of PP or PFA (option)
    Cleaning media: DI-water (standard), other cleaning media (option)
    Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials
    Rotation: up to 3000rpm, rotation up to 3000rpm in 5s
  • Megasonic nozzle (option):
    Frequency: 1 MHz (MHz option)
    Output Power: 30-60 W
    DI-water flow rate: up to 1.5 Liter/min
    Effective cleaning area: Ø 4.0 mm
    Material: PTFE
  • Megasonic area transducer (option):
    Frequency: 1 MHz (3 MHz option)
    Power: max. 2.5 W/cm² active areas (max. output 200 W)
    DI-water flow rate: up to 1.5 Liter/min
    Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation
    Material: SS and Sapphire
  • Brush (option):
    Material:  PVA
    Programmable parameters: brush and wafer speed (rpm)
    Adjustable parameters: brush compression, media dispense
  • Automated wafer handling system:
    The field proven class 1 compatible wafer handling robot on EVG320 enables 24 hour automated cassette-to-cassette or FOUP-to-FOUP operation for the highest throughput. Surfaces in contact with wafers do not cause any metal ion contamination.
  • Optional features:
    Class 1 mini-environment