GEMINI®FB Automated Production Fusion Bonding System

For fully automated and integrated wafer loading, alignment, bonding and unloading of bonded wafers.

Max. wafer size: 200mm, 300mm
Min. wafer size: 100mm, 150mm
Max. substrate size (mm x mm): N/A
Min. substrate size (mm x mm): N/A
Chucks for different wafer sizes: Option (conversion takes less than 30 min)
Metal ion free activation: Option
Max. 4 process gases:
2 standard process gases: N2 and O2
2 additional process gases: high purity gases (>99.999%),
noble gases (Ar, He, Ne, etc.),
forming gases (> 95% N2, Ar, He with < 5% O2)
Universal mass flow controller:
Vacuum system: Vacuum level: 9x10-2mbar (standard)
High vacuum system with turbo pump: Vacuum level: 9x10-3mbar (option)
High frequency RF generators: Standard
Matching unit: Standard
Opening/closing of chamber: Automated
Process license and BKM recipe: Standard
Supports optically aligned wafer bonding: Standard
Loading/unloading of chamber (wafer / substrate placed on loading pins): Automated
Process compatibility with EVG850 and GEMINI: Standard
Max. number of LowTemp plasma activation chambers: 2
Class 1 mini-environment: Option
Automated wafer handling system: Standard
Fab automation integration (SECS/GEM): Option
Throughput (wafers / substrates per hour): Up to 20 (depending on process and module configuration)
Production Scale: R&D, Pilot, HVM

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