For fully automated and integrated wafer loading, alignment, bonding and
unloading of bonded wafers.
GEMINI systems feature the fully automated way of bond alignment and bonding. The operator loads cassettes with unbonded wafers and picks up the finished substrates. Today's GEMINIs can be equipped with a variety of different pre-processing modules in order to fulfill customer requirements in a more flexible way.
- Higher throughput capability for fast fusion bonds
- Process modularity allows for upgradeability of additional modules
- Different pre-processing modules like cleaner, IR-inspection, plasma activation chamber available
- Unmatched sub-micron pre-bond alignment capability for non IR transparent substrates with SmartView technology
- Barcode reading systems for wafer substrate tracking