EVG®20 IR Inspection System

For wafer bond quality inspection.

 

Brochures
Please click the picture to download the brochure in PDF format


EVG Solutions for Metrology Short Brochure.pdf

 

Technical Papers

Please click the titles to download the full papers in PDF format



Adhesive wafer bonding for MEMS applications
Abstract: Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding...