EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps.
EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
- Adaptiveness for different metrology integrations (fully-automated or stand-alone) for highest flexibility. A multi-sensor measurement mount enables the use of different sets of sensor heads for changing measurement tasks.
- Handling of various substrate types in regards to materials, size, shape, stress, bow/warp.
- Control by active feedback loop on EVG's production tools and fully automated tuning of production parameters, including customized pass / fail decisions on the tool or via SECS/GEM interface.