SmartView®NT Automated Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

Substrate / Wafer parameters:
Size: 150mm - 200mm, 200mm - 300mm
Thickness: 0.1 - 5mm; Max. stack height: 10mm
General system configuration:
System rack: standard; Vibration isolation: active
Alignment methods:
SmartView alignment: ± 0.5µm 3σ
Backside alignment: ± 0.5µm 3σ
Transparent alignment: ± 0.3µm 3σ
IR alignment: Option
Alignment stage:
Precision micrometers: Motorized; Wedge compensation: Internal
Automatic alignment: Standard
Handling system: 3 cassette stations (up to 200mm) or 2 FOUP load ports / 300mm

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