EVG®620 Automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

Brochures
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EV Group Bond Aligner Brochure.pdf 

Technical Papers
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Aligned low temperature wafer bonding for MEMS manufacturing: challenges and promises
Abstract: The increased complexity of current generations of MEMS devices imposes new requirements for wafer bonding. Among these can be mentioned low process temperature (<400°C), precise optical alignment of substrates, ability to bond a large variety of substrates and the possibility to bond with defined intermediate layers...