EVG®6200∞ Automated Bond Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

  • Substrate / Wafer parameters:
    Size: 2", 3", 100mm, 150mm, 200mm; Thickness: 0.1 - 10mm; Max. stack height: 10mm
  • General system configuration:
    Desktop system: standard; System rack: option; Vibration isolation: passive
  • Alignment methods:
    Backside alignment: ± 2µm 3σ
    Transparent alignment: ± 1µm 3σ
    IR alignment: Option
  • Alignment stage:
    Precision micrometers: Manual, motorized (option)
    Wedge compensation: Internal 0.5 - 40N contact force
  • Automatic alignment: Option
  • Handling system: 3 cassette stations, 5 stations (option