With the invention of the world’s first double sided alignment system in 1985,
EV Group has revolutionized MEMS technology and set worldwide industry
standards in aligned wafer bonding by separating the alignment and bonding
process. This process separation results in higher flexibility and universal
application of the wafer bonding equipment. The EVG bond alignment systems
offer highest precision, flexibility, ease of use and modular upgrade
capability and have been qualified in numerous high throughput production
environments. The precision of EVG bond aligners accommodates most demanding
alignment processes in MEMS production and in emerging fields like 3D
integration applications.