Nanotechnologie
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Lithographie

   

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

   

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

   

EVG®150N Automated NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

   

EVG®510HE Semi-automated Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®520HE Semi-automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®620 Automated UV-NIL, µ-CP System

The EVG620 Automated NIL System allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

   

EVG®6200∞ Automated UV-NIL, µ-CP System

The EVG6200 Automated NIL System is designed for For pattern creation in UV-curable materials from a prestructured stamp to a substrate.

   

EVG®750 Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

   

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

   

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

Bonding

   

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

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EV Group bringt neue Generation des EVG120 Automated Resist Processing Systems auf den Markt

EV Group liefert 300mm Wafer Bonding System an führende chinesische Halbleiter-Foundry

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See Also

Related Products

EV Group Breaks through Resolution Barrier with Introduction of Soft UV Nanoimprint Lithography Technology

High Brightness LEDs

Microfluidics

Wafer Level Optics

Technische Publikationen

Product Range

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

EV Group HR Video

References


Consortium for Commercialization of Nano Imprint Lithography (NIL)