Advanced Packaging, 3D Interconnect
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EVG®770 Automated NIL Stepper
EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.
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Hercules® Lithography Track System
The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.
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IQ Aligner® Automated Mask Alignment System
The IQ Aligner Automated Mask Aligenment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment
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EVG®510 Semi-automated Wafer Bonding System
The EVG510 Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.
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EVG®540 Automated Wafer Bonding System
The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.
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EVG®620 Automated Bond Alignment System
Known for its high level of automation and reliability, the EVG620 Automated Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.
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EVG®850 Automated Production Bonding System for SOI
The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.
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