Advanced Packaging, 3D Interconnect
 Related Products

Lithographie

   

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

   

EVG®101LA Large Area Coating System

The EVG101LA Large Area Coating System is designed for cost effective coating on large areas.

   

EVG®120 Automated Resist Processing System

The EVG120 Automated Resist Processing System is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications.

   

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

   

EVG®40 Top-to-bottom side Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

   

EVG®620 Automated Mask Alignment System

Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available.

   

EVG®6200∞ Automated Mask Alignment System

With full field proximity exposure of very thick resist layers, the EVG6200 Infinity Automated Mask Alignment System targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.

   

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

   

Hercules® Lithography Track System

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

   

IQ Aligner® Automated Mask Alignment System

The IQ Aligner Automated Mask Aligenment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment

   

IQ Aligner® Automated UV Nanoimprint Lithography System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

Bonding

   

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

   

EVG®510 Semi-automated Wafer Bonding System

The EVG510 Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

   

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

   

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

   

EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System

The EVG540C2W is designed for permanent bonding on chips to wafer (C2W) on wafer scale.

   

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

   

EVG®620 Automated Bond Alignment System

Known for its high level of automation and reliability, the EVG620 Automated Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.

   

EVG®6200∞ Automated Bond Alignment System

The EVG6200 Automated Bond Alignment System is designed for wafer-to-wafer alignment for subsequent wafer bonding applications up to 200 mm wafer sizes.

   

EVG®810LT LowTemp™ Plasma Activation System

The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

   

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

   

EVG®850DB Automated Debonding System

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.

   

EVG®850TB Automated Temporary Bonding System

The EVG850 bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

   

GEMINI® Automated Production Wafer Bonding System

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

   

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment