Advanced Packaging, 3D Interconnect

Darunter werden fortschrittliche Techniken der Kontaktierung, des Verbindens und Testens von fertigen ICs auf Waferebene zusammengefasst.


 

  ICEPlogo

ICEP-IAAC 2015
April 14 - 17, 2015, Kyoto Terrsa, Kyoto, Japan

Visit our presentation about "Low/Room Temperature Wafer Bonding Technologies for Three-Dimensional Integration" at ICEP-IAAC 2015.

 


Header_SEMI Packaging Tech SeminarSEMI Packaging Tech Seminar 2015
June 18, 2015, Vila do Conde, Portugal

Visit us at the SEMI Packaging Tech Seminar 2015.

 


semicontwSEMICON Taiwan 2015
September 02 - 04, 2015, TWTC, Taipei, Taiwan

Visit us at booth # 706 at SEMICON Taiwan 2015.

 


semiconeuropaSEMICON Europa 2015
October 06 - 08, 2015, Dresden, Germany

Visit us at booth # 1324 at SEMICON Europa 2015