Accolade for the Small Suppliers of Wafer Processing Equipment Category
Recognizes Company’s Ongoing Commitment to Deliver Superior Customer
ST. FLORIAN, AUSTRIA, July 1, 2008 – EV Group, based in
St. Florian/Inn, Austria, is pleased to announce that the company has
received the distinction of being ranked as one of the world’s 10 BEST
small suppliers of wafer processing equipment by VLSI Research, Inc.
Marking the sixth year in a row that EVG has been recognized for this
honor, this award is based on the results of the recently completed VLSI
Research 2008 Customer Satisfaction Survey, which gathered ratings on over
220 equipment suppliers.
“Receiving this distinction for the sixth consecutive year not only
validates that we are highly committed to establishing and sustaining
strong, ongoing relationships with our customers, it also demonstrates that
we have consistently provided the same high-level of superior customer
satisfaction for a significant amount of time,” explained Hermann Waltl,
EVG’s senior vice president of sales. “We thank our customers for their
continued support and confidence in our business. We will not only remain
committed to improving our service and support, but strive to implement
new, creative ways to best serve our worldwide customer base.”
About the Survey
The VLSI Research annual Customer Satisfaction Survey on Chip Making
Equipment is the only publicly available opportunity for chip manufacturers
to provide feedback on their suppliers. The 10 BEST rankings award special
recognition to the suppliers that are rated highest by their customers.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119