Significant Multi-Million-Euro Order Win Furthers EVG’s Reach in the 3D
Interconnect Space
ST. FLORIAN, AUSTRIA, July 8, 2008 - EV Group, a leading
supplier of wafer-bonding and lithography equipment for the advanced
semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging
nanotechnology markets, today announced it has received a major
multi-million-euro order from STMicroelectronics (NYSE: STM) for its 300-mm
bonding, alignment and photoresist processing tools. EVG’s fully
automated tools are successfully installed at ST’s 300-mm
through-silicon-via (TSV) pilot line in Crolles, France and used in the
manufacture of CMOS imaging sensors (CIS).
Industry experts have anticipated that the first products that feature TSV
technology are expected to hit the market in 2008 and will include flash
memory and image sensors, similar to what ST is developing with the help of
EVG’s 300-mm solutions. The production of these devices by a
high-volume manufacturer (HVM) like ST marks a significant validation
milestone for this technology, which is still in its infancy. TSV
adoption, however, continues to rapidly gain traction, given its
demonstrated advantages that include higher performance, increased
functionality, a smaller footprint and lower power consumption.
Recognizing the potential early on, EVG has been a champion of bringing
this technology to market commercialization. Key to this effort, the
company is a founding member of the EMC-3D international consortium, which
is chartered with developing the 3D market infrastructure by demonstrating
a cost-effective, manufacturable, stackable TSV interconnection
technology.
According to Gareth Bignell, Program Manager, 300mm Equipment Selection,
STMicroelectronics, “ST is committed to accelerating the manufacturing of
3D TSV-based devices into high volume. As such, we’re turning to
trusted suppliers, like EVG, who can help us maintain our competitive edge
by minimizing manufacturing risks, while increasing the speed of
implementation and time to market. At the same time, we also expect
nothing less than superior and comprehensive service and support so that
our facility can continue to run at benchmark levels - we expect that EVG’s
solid and dependable support will continue to be a significant help in this
area.”
“We are extremely pleased with the confidence ST, a long-standing customer
of our 200-mm solutions, now also has in our leading-edge 300-mm portfolio,
which is ideally suited for the burgeoning, but complex, 3D-TSV
market. Yet, we believe TSV technology holds tremendous potential and
we are poised and committed to being a key player in this space,” said
EVG’s Executive Technology Director, Paul Lindner. “This milestone
order from ST is testament to our ability to meet this chipmaker’s rigorous
demands for reliable performance, uniformity and repeatability - backed, of
course, by our unwavering 24/7 customer support,” he added.
According to Lindner, a number of factors contributed to the company’s
recent win with ST over the competition. Specifically, EVG’s
new NanoSpray photoresist coating processing capabilities for steep
topographies; along with its IQ Aligner’s proven ability to deliver precise
and reliable lithography backside alignment, are both unparalleled in the
industry. This, coupled with EVG’s bonder demonstrated high
uniformity at 300mm - and the company’s comprehensive service and dedicated
onsite support were critical factors behind this most recent purchasing
decision by ST. EVG reports that the ST order also included its
EVG150 Coater and EVG150 Developer, which in conjunction with its NanoSpray
technology, consistently deliver highly uniform coats with low material
usage and improved repeatability.
EV Group will be exhibiting at SEMICON West, July 15-17, 2008 at the
Moscone Center in San Francisco, CA, USA. Editors and analysts
interested in learning more about the company and its complete product
range for 3D Interconnect and TSV are invited to visit EVG’s booth #5429
(North Hall).
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com