Overall Revenues Increase More Than 15-Percent Based On Growing Demand
Among
3D Interconnect and Nanoimprint Lithography Markets
ST. FLORIAN, AUSTRIA, November 19, 2008 – EV Group (EVG),
a leading supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, today announced that the company
witnessed a more than 15-percent increase in overall revenue during fiscal
2008, ended September 30. EVG attributes this growth, in large part, to
burgeoning demand in both the 3D interconnect/through-silicon via (TSV) and
nanoimprint lithography (NIL) markets. Despite the current global economic
slowdown, the company remains cautiously optimistic about its outlook for
2009 given the expected growth opportunities to ensue as these novel
technologies gain market acceptance/penetration.
According to EVG Founder and President Erich Thallner, EVG capitalizes on
its technology and market leadership by continuously building upon its
extensive experience in bringing new and innovative products to the market.
“Our leading-edge solutions provide a true value add to our customers and
are the cornerstone in strengthening our technology leadership position and
market share. To this end, our strategy has always been to leverage our
existing core capabilities and extend this knowledge and expertise into
other synergistic markets that can truly benefit from us. This has allowed
EVG to grow consistently over the years since our inception in
1980—ultimately enabling us to weather some of the effects associated with
various cyclical industries like the semiconductor market, even at the most
tumultuous of times, like we are seeing today.”
Thallner added, “Looking ahead, even though the macroeconomic environment
is expected to be more challenging in 2009, specifically in market segments
that are automotive and consumer-product driven, we expect that new
technologies, such as backside illuminated image sensors or even higher
functional density cell phones, will drive continued growth for EVG’s 3D IC
lithography and wafer bonding equipment, among others.”
As part of its quest to bring novel technologies to market, EVG will
continue to invest in 3D/TSVs and NIL in order to help its customers
overcome the yield and performance challenges as they scale down to 32- and
22-nm geometries. Citing its success to date with NIL, the company recently
announced that it has shipped its 100th NIL system. The milestone shipment
reinforces the company’s leadership in the NIL market, of which EVG holds
an approximate 30-percent market share with the most systems in the field.
The company also credits increasing order wins among leading universities
for advanced research and development activities as another key 2008
milestone. In its most recent win last month, EVG reported that three
European universities—Southampton University, University of Ulster and
Technische Universitat Braunschweig—had placed orders for multiple
next-generation EVG systems for leading-edge MEMS research, totaling in
excess of US$2.9 million.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers’
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume. More information is
available at www.EVGroup.com.
Contacts:
EV Group Contacts: Clemens Schütte
Director, Marketing and Communications
EV Group Tel: +43 7712 5311 0
E-Mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com