News Archiv 2007

EV Group and Brewer Science's New Ultra-thin-Wafer Bonding Technology

December 4, 2007 - A key industry milestone has been reached today surrounding the handling and processing of ultrathin wafers. In their ongoing joint development work, EV Group and Brewer Science, Inc., unveiled they have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through-silicon vias (TSVs) and backside metallization.
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EV Group Achieves Record Growth in Fiscal 2007 - Posting 30% Increase over 2006 in Order Intake and Revenue

November 6, 2007 - Record Growth in Fiscal 2007 - Posting 30% Increase over 2006 in Order Intake and Revenue

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EV Group Achieves Key MEMS Market Milestones, Installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-Volume Manufacturing Environments

November 1, 2007 – EV Group today announced it has successfully installed its 500th bond chamber and 100th automated production wafer bonder for high-volume manufacturing.
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EV Group´s new EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-thin Wafer Processing

October 9, 2007 - EV Group today announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers.
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Ultra-thin Wafer Handling Solution Introduced by Brewer Science and EV Group

July 16, 2007 - EV Group, and Brewer Science, Inc., announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing.
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EV Group Signs Contract with SemiProbe for Worldwide Distribution of Wafer Probing Systems

July 10, 2007 - EV Group today announced that it has signed a distribution agreement with SemiProbe a leading supplier of wafer level probing systems.
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Customers Rank EVG in 10 BEST for 5 Years Consecutively in the VLSI Research Wafer Processing Equipment Customer Satisfaction Survey

June 26, 2007 - EV Group has been honored among the 10 BEST in the category of Small Suppliers of Wafer Processing Equipment.
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Danchip Selects EVG620 Mask Aligner from EV Group

May 24, 2007 - EV Group has successfully installed an EVG620 Mask Aligner at DANCHIP.
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EV Group and GenISys Form Ongoing Development Collaboration on Advanced Mask Aligner Lithography Simulation for MEMS

February 7, 2007 - EV Group announced it has formed a collaborative product development partnership with GenISys GmbH for the development and marketing of a simulation platform for advanced mask aligner lithography processes.
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