News Archiv 2007
December 4, 2007 - A key industry milestone has been reached
today surrounding the handling and processing of ultrathin wafers. In their
ongoing joint development work, EV Group and Brewer Science,
Inc., unveiled they have demonstrated temporary wafer bonding capabilities
for a wide range of backside processes, including through-silicon vias (TSVs)
and backside metallization.mehr... November 6, 2007 - Record Growth in Fiscal 2007 - Posting 30% Increase over
2006 in Order Intake and Revenue
mehr... November 1, 2007 – EV Group today announced it has
successfully installed its 500th bond chamber and 100th automated production
wafer bonder for high-volume manufacturing.mehr... October 9, 2007 - EV Group today announced that a major
Austrian semiconductor manufacturer has selected and installed an EVG850TB
fully automated temporary bonding system for high-volume processing of thin-
and ultra-thin device wafers.mehr... July 16, 2007 - EV Group, and Brewer Science,
Inc., announce that they have introduced a new system and offer new
capabilities and yield performance for UltraThin Wafer Processing.mehr... July 10, 2007 - EV Group today announced that it has
signed a distribution agreement with SemiProbe a leading supplier of wafer
level probing systems.mehr... June 26, 2007 - EV Group has been honored among the 10 BEST
in the category of Small Suppliers of Wafer Processing Equipment.mehr... May 24, 2007 - EV Group has successfully installed an EVG620
Mask Aligner at DANCHIP.mehr... February 7, 2007 - EV Group announced it has formed a
collaborative product development partnership with GenISys GmbH for the
development and marketing of a simulation platform for advanced mask aligner
lithography processes.mehr...