ST. FLORIAN, AUSTRIA, June 26, 2007 - EV Group, based in
St. Florian/Inn, Austria, is pleased to announce this year´s result of the
VLSI Research Customer Satisfaction Survey. Since 2003 EV Group has been
honored among the 10 BEST in the category of Small Suppliers of Wafer
Processing Equipment. Customers rated EVG consecutively and especially well
for quality of results, and for the company´s commitment to supporting its
customers´ needs. EVG is a leading contributor in various technologies,
including mask alignment, wafer bonding, wafer coating and cleaning; EVG is
dedicated to providing the very best in customer support.
This positive trend shows the quality of our equipment and emphasis on
customer satisfaction in comparision to our competitors. These are the
fruits of over 27 years of successful research and development and a
trust-based partnership with our longtime customers. The company´s vision
of "being the first in exploring new techniques and serving next generation
applications of micro and nano fabrication technologies" enables its
customers to successfully commercialize their new ideas. This ensures EVG
longterm financial stability and creates the foundation of continuous
development and success.
About the survey
The VLSI Research annual Customer Satisfaction Survey on Chip Making
Equipment is the only publicly available opportunity for chip manufacturers
to provide feedback to their suppliers. The 10 BEST rankings award special
recognition to the suppliers that are rated highest by end-users on a
ten-point scale among thirteen categories that exemplify a supplier´s
relationship with its customers.
About EV Group
EV Group (EVG) is a world leader in
wafer-processing solutions for semiconductor, MEMS and nanotechnology
applications. Through close collaboration with its global customers, the
company implements its flexible manufacturing model to develop reliable,
high-quality, low-cost-of-ownership systems that are easily integrated into
customers’ fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Tel: +43 7712 5311 0
Tel: +1-650-968-8900, ext. 119