ST. FLORIAN, AUSTRIA, July 10, 2007 - EV Group, a leading
supplier of wafer-bonding and lithography equipment for the advanced
packaging, MEMS and semiconductor markets, announced today that it has
signed a distribution agreement with SemiProbe a leading supplier of wafer
level probing systems. As a global distributor for SemiProbe, this
agreement enables EV Group to offer SemiProbe´s family of manual,
semiautomatic and fully automatic probing systems to their customers in
combination with EVG process equipment.
"The SemiProbe probing family allows EVG to have a Test Tool to probe all
bonded wafers either post bond (SemiProbe stand alone prober) or pre and
post bond (integrated in EVG systems). This approach allows 24/7 production
with minimum intervention," said Thomas Wagenleitner, Product Manager from
EV Group.
The SemiProbe probe systems meet a wide variety of applications from labs
to high volume production. Customers have the option of purchasing a stand
alone probe system or a turn key, application specific probing/testing
solution. SemiProbe provides several new solutions ranging from engineering
probe systems to "Known Good Die systems" to small footprint and high
throughput production systems. SemiProbe also offers the world's first
"PROBE SYSTEM FOR LIFE" (PSL) family of probers that provide customers with
a perpetual upgrade path from manual to automatic. The PSL provides the
customer with significant capital equipment savings by allowing them to
purchase what they need and can afford now while allowing them to field
upgrade later as their needs change.
"Partnering with EVG is an opportunity to expand SemiProbe into new global
markets that involve integrated process and test solutions," said Denis
Place, CEO of SemiProbe. "Our probe systems are state of the art and are
supplementary to EVG Bonding and alignment process systems," he added.
EV Group extends its technology and market leadership by offering
complementary partner products, giving our customers a single source to
meet all their wafer processing needs
For additional information on the SemiProbe Probing Products contact
SemiProbe at info@semiprobe.com or visit semiprobe.com
For additional information on EV Group Products contact EV Group at
sales@EVGroup.com or their website www.EVGroup.com Visit us at Semicon
West: July 16 - 20 2007, San Francisco, North Hall Booth # 5429
About SemiProbe
SemiProbe, founded in 2005 by three Semiconductor Industry veterans with
more then 30 years of probing experience, provides innovative and
application specific probing solutions to a variety of markets. A family of
manual, semiautomatic and fully automatic systems with a complete line of
accessories are available. Standard and customized probing solutions are
provided for the R&D, Failure Analysis, Device Characterization, High
Frequency/Microwave, MEMS, Optoelectronics, Packaged Part and Production
communities. The company´s development of the "Known Good Die" and "PROBE
SYSTEM FOR LIFE" families provide innovative, pioneering and cost effective
probing solutions to the industry. System design and Test Application
expertise has made SemiProbe a leader in integrating third party tools to
our probe systems. For more information, please visit semiprobe.com
Contact:
Don Feuerstein
Marketing Communications
SemiProbe LLC
245 South Park Drive
Colchester, VT 05446
Phone: 802-860-7000, FAX: 810-885-2900
E-Mail: don@semiprobe.com
About EV Group
EV Group (EVG) is a world leader in
wafer-processing solutions for semiconductor, MEMS and nanotechnology
applications. Through close collaboration with its global customers, the
company implements its flexible manufacturing model to develop reliable,
high-quality, low-cost-of-ownership systems that are easily integrated into
customers’ fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, AZ;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan.
The company's unique Triple i-approach (invent - innovate - implement) is
supported by a vertical integration, allowing EVG to respond quickly to new
technology developments, apply the technology to manufacturing challenges
and expedite device manufacturing in high volume.
Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com