EV Group Signs Contract with SemiProbe for Worldwide Distribution of Wafer Probing Systems

ST. FLORIAN, AUSTRIA, July 10, 2007 - EV Group, a leading supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets, announced today that it has signed a distribution agreement with SemiProbe a leading supplier of wafer level probing systems. As a global distributor for SemiProbe, this agreement enables EV Group to offer SemiProbe´s family of manual, semiautomatic and fully automatic probing systems to their customers in combination with EVG process equipment.

"The SemiProbe probing family allows EVG to have a Test Tool to probe all bonded wafers either post bond (SemiProbe stand alone prober) or pre and post bond (integrated in EVG systems). This approach allows 24/7 production with minimum intervention," said Thomas Wagenleitner, Product Manager from EV Group.

The SemiProbe probe systems meet a wide variety of applications from labs to high volume production. Customers have the option of purchasing a stand alone probe system or a turn key, application specific probing/testing solution. SemiProbe provides several new solutions ranging from engineering probe systems to "Known Good Die systems" to small footprint and high throughput production systems. SemiProbe also offers the world's first "PROBE SYSTEM FOR LIFE" (PSL) family of probers that provide customers with a perpetual upgrade path from manual to automatic. The PSL provides the customer with significant capital equipment savings by allowing them to purchase what they need and can afford now while allowing them to field upgrade later as their needs change.

"Partnering with EVG is an opportunity to expand SemiProbe into new global markets that involve integrated process and test solutions," said Denis Place, CEO of SemiProbe. "Our probe systems are state of the art and are supplementary to EVG Bonding and alignment process systems," he added.

EV Group extends its technology and market leadership by offering complementary partner products, giving our customers a single source to meet all their wafer processing needs

For additional information on the SemiProbe Probing Products contact SemiProbe at info@semiprobe.com or visit semiprobe.com
For additional information on EV Group Products contact EV Group at sales@EVGroup.com or their website www.EVGroup.com Visit us at Semicon West: July 16 - 20 2007, San Francisco, North Hall Booth # 5429

About SemiProbe
SemiProbe, founded in 2005 by three Semiconductor Industry veterans with more then 30 years of probing experience, provides innovative and application specific probing solutions to a variety of markets. A family of manual, semiautomatic and fully automatic systems with a complete line of accessories are available. Standard and customized probing solutions are provided for the R&D, Failure Analysis, Device Characterization, High Frequency/Microwave, MEMS, Optoelectronics, Packaged Part and Production communities. The company´s development of the "Known Good Die" and "PROBE SYSTEM FOR LIFE" families provide innovative, pioneering and cost effective probing solutions to the industry. System design and Test Application expertise has made SemiProbe a leader in integrating third party tools to our probe systems. For more information, please visit semiprobe.com

Contact:
Don Feuerstein
Marketing Communications
SemiProbe LLC
245 South Park Drive
Colchester, VT 05446
Phone: 802-860-7000, FAX: 810-885-2900
E-Mail: don@semiprobe.com

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

Contacts:
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com

 

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