Company's Fully Automated Wafer Bonding and Aligner Technology to be
Installed
at
Europe's First-ever 8-inch MEMS Fab
ST. FLORIAN, AUSTRIA, February 3, 2009 - EV Group (EVG), a
leading supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, today announced that Sweden-based
Silex Microsystems, the world's largest independent MEMS foundry, has
placed a major follow-on order for its GEMINI automated bond cluster, EVG
6200NT mask and bond aligner and EVG301 mask cleaner-all of which will be
used in the production of highly sophisticated MEMS devices for
applications spanning the biotech/medical, telecom, automotive and consumer
electronics industries, among others. EVG reports that installation
is slated for spring 2009 at Silex's new 8-inch MEMS facility-the first of
its kind in Europe-located in Järfälla, Sweden.
"Our company is dedicated to bringing advanced process technologies and
manufacturing excellence to our nearly 80 customers worldwide," said Jan
Nerdal, Silex CEO. "As a pure-play MEMS manufacturer, we expect only
the best from our suppliers when it comes to delivering cost-effective,
yet, superior process capabilities, quality and support. EVG has been
a valued supplier to Silex since we commenced operations in
2000-consistently delivering over this time, the wafer bonding and aligner
solutions we've needed to manufacture our myriad best-in-class MEMS
devices. Our recent order with EVG demonstrates the confidence we
have in them toward helping us effectively transition from semi-automatic
wafer bonding to fully automated production at our prized 8-inch MEMS
fab-seamlessly and efficiently."
Commenting on the order, Paul Lindner, EVG's executive technology director,
noted, "EVG prides itself on our ongoing commitment to working closely with
our customers to ensure their manufacturing processes, and ultimately, fab
operations, are running at benchmark levels. For close to three
decades now, we've been delivering the best-of-breed equipment and process
expertise to today's MEMS value chain-all at a low cost of ownership
(CoO). Our longstanding relationship with Silex and recent follow-on
order win speaks volumes to the satisfaction shared among today's MEMS
community in our ability meet today's exacting MEMS manufacturing
requirements."
EVG's GEMINI platform is a field-proven, production manufacturing solution
for high-volume wafer bonding applications for MEMS, 3D integration and
advanced packaging, as well as compound semiconductor applications.
With more than 100 automated wafer bonder installations worldwide, the
GEMINI is designed for the lowest total COO and quickest return on
investment. The tool incorporates EVG's patented SmartView bond
aligner, which delivers high-precision aligned direct bonding. The
GEMINI also features integrated pre-process modules, such as the EVG301
wafer cleaner. Moreover, the system can provide low-temperature
plasma activation (silicon direct bonding), and is expandable through four
bond chambers to achieve even higher throughputs. The recent order
from Silex also includes EVG's 6200NT Aligner, which is the newest
generation of the company's more versatile precision alignment tools.
Silex Microsystems
Silex is an independent Swedish MEMS foundry that commenced operations in
2000. MEMS are complex mechanical and electrical systems on a micro
scale, built in the form of a chip. The minute scale has great
advantages and MEMS usage is growing fast in the consumer electronic
industry, the automotive industry and in the medical technology sector,
among other industries. Silex has nearly 80 customers, of which ten
are large volume customers. Development and production of MEMS takes
place at the company's manufacturing plant in Järfälla. For more
information, visit www.silexmicrosystems.com.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers'
fab lines. Key products include wafer bonding,
lithography/nanoimprint lithography (NIL) and metrology equipment, as well
as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium
in 2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors.
Other target semiconductor-related markets include silicon-on-insulator
(SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.;
Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high
volume. More information is available at www.EVGroup.com.
EV Group Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-Mail: Marketing@EVGroup.com
Marie Labrie
Vice President
MCA, Inc.
Tel: +1-650-968-8900, ext. 119
E-mail: mlabrie@mcapr.com