Join EVG at SEMICON Europa 2012!
Visit our booth #1.425 in hall 1, Messe Dresden to discuss your semiconductor, MEMS and Nanotechnology manufacturing needs.
Mark your calendar to attend our presentations:
Advanced Packaging Conference, sponsored by EVG
Tue, October 9, 13:45 - 14:10, Ballroom, Messe Dresden
Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration
Dr. Thorsten Matthias, Business Development Director, EV Group
SEMI Europe Executive Summit
Tue, October 9, 16:00 - 18:30, Room Hamburg 1, Messe Dresden
What will be Europe's most viable product/market strategies for the coming 5 years and what will be the impact of 450mm to the Semiconductor Landscape in Europe?
Invited panelist: Paul Lindner, Executive Technology Director, EV Group
Advanced Packaging Conference, sponsored by EVG
Wed, October 10, 10:35 - 11:00, Ballroom, Messe Dresden
A New Single Wafer Cleaning Technology for Advanced Packaging Applications
Martin Schmidbauer, Product Manager, EV Group
TechARENA, LED/SSL Session
Thu, October 11, 14:10 - 14:30, TechARENA 2, Messe Dresden
Engineered Substrates and Wafer Bonding for Vertical LEDs
Dr. Thomas Uhrmann, Business Development Manager, EV Group
Check our Press Center for the latest EVG News.
We look forward to meet you in Dresden!