Join EVG at SEMICON Taiwan 2014
Visit our booth #316 to discuss your semiconductor, MEMS and Nanotechnology manufacturing needs and learn about our latest product news
Read our latest news:
EV Group Clears Key Barriers to 3D-IC/TSV High-Volume Manufacturing with Breakthrough Fusion Wafer Bonding Solution
EV Group Boosts 2.5D and 3D-IC/TSV Performance with New NanoSpray™ Application on EVG150XT High-Volume-Manufacturing Photoresist Processing System
||EV Group (EVG) announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications. NanoSpray provides conformal coating of structures that have vertical sidewall angles-such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs-with thick polymer liners and photoresists. This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.
EVG presentations at SEMICON Taiwan 2014:
EVG Presentation: "State of the Art Wafer Bonding for 3D Integration of MEMS & CMOS for Smart Sensors"
Thursday, September 4th, 2014 | 11:05 - 11:30 | Room 401
SiP Global Summit 2014 - 3D IC Technology Forum
EVG Presentation: "Hybrid Wafer Level Bonding for 2.5D Interposer and 3DIC Manufacturing (An Equipment Perspective)"
Thursday, September 4th, 2014 | 14:35 - 15:00 | Room 504, 5F
EVG Presentation: "High Volume Wafer Level Mask Aligner and Resist Processing Solutions"
Friday, September 5th, 2014 | 11:00 - 11:30