Join EVG at SEMICON Korea 2013!
EVG presents industry leading wafer processing equipment at SEMICON Korea 2013, addressing 3D integration, thin wafer handling and advanced packaging applications. Featuring EVG's leading-edge mask alignment technology as well as new equipment platforms for high-volume manufacturing, including next-generation resist processing / coating and development systems, advanced temporary bonding / debonding clusters and the world's first 450 mm wafer bonder.
Read the Press Release about the EVG150 Automated Resist Processing Platform in English language
Read the Press Release about the EVG850TB/DB XT Frame Temporary Bonding / Debonding Platform in English language
We look forward to meet you in Seoul!