新闻发布

• EV Group Files Patent Infringement Lawsuit against the 3M Company
• Heptagon Micro-optics Pte Ltd. adopts EV Group's IQ Aligner for Patterning Microlenses for Next-Generation CMOS Image Sensors
• EV Group Supplies 300-mm Equipment to ST Microelectronics for the manufacture of image sensors using TSV technology
• EV Group (EVG) Named among VLSI Research's 10 Best Suppliers for Sixth Consecutive Year
• EV Group to Expand Presence in Korea with opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts
• NanoTecCenter Weiz selects EV Group Mask Aligner for Advanced R&D Facility focused on Organic Electronics
• EV Group Secures Multiple System Order From Colibrys For Production of MEMS-based Motion Sensors
• Indian Institute of Technology, Bombay, selects EV Group Systems for Micro-Fabricated Sensor Research and Development Project
• EV Group wins Multi-Million-Euro order from leading European Electronics Manufacturer for High-Volume Production of Flexible Displays
• EV Group and Brewer Science's New Ultrathin-Wafer Bonding Technology
• EVG achieves record growth in Fiscal 2007 - Posting 30% increase over 2006 in order intake and revenue
• EVG achieves key MEMS Market Milestones, installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-Volume Manufacturing Environments
• EV Group´s new EVG850TB Bonding System selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-Thin Wafer Processing
• Major Austrian semiconductor Manufacturer broadens MEMS and Display device Packaging capacity with installation of fourth IQ Aligner from EV Group.
• UltraThin Wafer Handling solution introduced by Brewer Science and EV Group (EVG)
• EV Group (EVG) signs contract with SemiProbe for worldwide distribution of Wafer Probing Systems
• Customers Rank EV Group (EVG) in 10 BEST for 5 years consecutively in the VLSI Research Wafer Processing Equipment Customer Satisfaction Survey.
• Danchip selects EVG620 Mask Aligner from EV Group (EVG)
• EV Group signs contract with McBain Instruments for worldwide distribution of ZIII-NIR Wafer Inspection System
• EV Group (EVG) and GenISys form ongoing development collaboration on advanced mask aligner lithography simulation for MEMS
• EV Group and Sonix Inc. begin joint cooperation and sign Reseller Distribution Agreement
• EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology (AC2W) and installed EVG540C2W System
• EMC-3D Consortium Created for the Development of Cost-Effective 3D Thru-Silicon-Via Interconnect
• EV Group and Brewer Science cooperate in the development of ultrathin wafer handling solutions for the microelectronics industry
• EV Group offers first online shop provided by a semiconductor process equipment manufacturer at www.EVGTShop.com
• Customers Rank EV Group in Top Half of the VLSI Research 10 BEST
• AMO GmbH has installed the worldwide first step-and-repeat nanoimprint lithography system for industrial fabrication of nanoscale devices from EV Group
• New Nano Spray technology from EVG achieves conformal coating of extreme surface topographies
• EV Group Celebrates its 25th Company Anniversary and 15 Years Supplying High Volume MEMS Manufacturing Equipment
• EV Group to supply NIL Fab, Inc. with High-throughput NanoImprint Lithography System for Prototyping and Low-Volume Production
• EV Group Wins Order from Heptagon for Nanoimprint Lithography Production Equipment for Micro Optic Devices
• IME to develop fully-integrated Lab on Chip with EV Group equipment
• EV Group to support nanofabrication technologies at Stanford with nanoimprint tool
• EV Group installs EVG620 mask aligner at SiTek Electro Optics
• EV Group announces new Board of Management
• EV Group installs industry-leading low-temperature wafer bonding system at Silicon Microstructures Inc.
• EV Group will launch new generation of industry-leading wafer bonders at Semicon Europa
• EV Group ships Gemini Production Wafer Bonder to DALSA for volume MEMS production
• EV Group wins Austrian Innovation Award 2004
• EV Group gewinnt den Staatspreis Innovation 2004
• EV Group´s new headquarters supports growing North American customer base and R&D with Arizona State University and U.S. Army
• EV Group collaborates with Jinsan Scientific Co. Ltd. on new cleanroom facility at Korea's Sung Kyun Kwan University
• EV Group´s IQ Aligner to support Promerus LLC´s work on materials for advanced wafer-level packaging
• EV Group launches a step-and-repeat nanoimprint lithography system for industrial fabrication of nanoscale devices
• EV Group launches global consortium to speed commercialization of nanoimprint lithography
• EV Group and Komag Inc. collaborate on world´s first high-volume nanoimprint lithography application for data storage
• EV Group gewinnt den Innovationspreis 2004 des Landes Oberösterreich
• EV Group and Datacon announce cooperation on advanced-chip-to-wafer technology (AC2W technology)
• High-tech Kooperation in Österreich: Datacon und EV Group realisieren gemeinsames Forschungsprojekt mit Infineon
• EV Group expands North American operations, adds research facilities in Arizona and New York
• EV Group expands UV-nanoimprint consortium, sponsors Canadian nanotechnology conference
• EV Group opens second customer-support center in Japan
• EV Group ships LowTemp production bonder to substrates manufacturer
• EV Group unveils NanoAlign Technology, new mask aligner at SEMICON West
• EV Group Penetrates Microdisplays Market With Sale to MicroEmissive Displays
• EV Group Experiences Surge of Asia-based Orders For Nanotechnology Development
• EV Group Secures Key Order For LowTemp Wafer Bonder From Major Japanese Manufacturer
• EV Group to Unveil Next-Generation Spray Coater and Chinese Web Page at SEMICON China
• EV Group has been selected as major supplier for Beijing's Tsinghua-Foxconn Nanotechnology Center
• EV Group and AMO GmbH establish a Cooperation on Nanoimprint Lithography
• DALSA selects EV Group as Strategic Supplier for MEMS Wafer Bonding & Thick Polymer Lithography Production Equipment
• McGill University selects EV Group equipment to build nanotools
• EV Group and SiGen forge wafer bonding alliance on Next-Generation Plasma Bonding
• EV Group's aligner and bonder enhance biochip research at ASU
• IMEC and EV Group will jointly develop new wafer-level packaging and MEMS wafer bonding techniques
• NRC-IMI selects EV Group to supply a Nanoimprint/Hot embossing system
• EV Group presents new company website www.EVGroup.com
• EV Group sells Production Lithography Package to Silex
• CEA-LETI selects EV Group's hot embossing system to conduct nanotechnology research
• EV Group introduces a new wafer edge inspection system at SEMICON West
• EV Group's temporary bonding and debonding technology enables thinned wafer processing in high volume manufacturing
• EV Group supports Waseda University on Nanotechnology Research
• EV Group Celebrates Opening of New Joint Venture Company in Taiwan
• EVG highlights 300 mm Automated IQ Aligner at SEMICON Europa 2003
• EV Group ships volume MEMS production equipment to Asia Pacific Microsystems Inc.
• EV Group strengthens its activities in the advanced packaging market
• EV Group provides industry first 300 mm volume production wafer bonding system
• Japanese Wafer Manufacturers Produce with SOI Wafer Production Bonding Systems from EVG
• EV Group Announces New EVG40 Series Top-to-Bottom Side Alignment Accuracy Measurement Systems
• EVG highlights Production Resist Processing System for Spin Coating and Developing at SEMICON Japan 2002
• XinTec Inc. Expands Shellcase Chip Scale Packaging Technology with EV Group's Production Mask Aligner and Resist Coater
• EV Group expands its operations into Taiwan
• EV Group's SOI wafer bonding system provides volume, quality and yield enhancements at Analog Devices' SOI wafer production fab
• EV Group appoints new General Manager for EV Group Japan
• HL-Planartechnik Expands Sensor Production With EV Group's HERCULES Lithography Track System
• EVG Displays HERCULES Lithography Track System at SEMICON Europa 2002
• EV Group Expands Production Facility and Worldwide Staff
• EVG highlights 300 mm SOI Wafer Production Equipment at SEMICON Europa 2002
• EVG ships fully-automated 300 mm SOI production bonding system to Soitec
• EV Group Receives SEMI's "Best Paper" Award at SEMICON Taiwan