关键词汇

Wafer:
A disc made of a semiconductor material (for example silicon, germanium, gallium arsenide …); it is the basic material which our customers process on our machines.

Cleaner:
Wafer Cleaners remove microscopically small particles (smaller than 1/1000 mm) from the wafer surface in order to guarantee further processing of the wafer.

Resist Coater:
Coaters apply a uniform, thin layer of light sensitive material (resist) onto the wafer. This layer of resist is selectively exposed and later it will dissolve in a developer.

Mask Aligner:
Mask Aligners transfer a structure from a mask to the wafer using UV light (= photolithography); for this the mask needs to be aligned precisely to the wafer.The accuracy of this alignment as well as the size of the applied structures is in the micrometer range (= 1/1000 mm).

Bond Aligner:
Bond Aligners align two wafers to each other; these wafers are bonded (stacked together) afterwards.

Developer:
Developers develop the photoresist on the wafer. The areas, which were hardened using UV light, remain, the areas, which were not exposed, are removed – a structure is created.

Wafer Bonder:
“To bond” = to connect, glue;Wafer Bonders “connect” two or more fully structured wafers. The atoms near the surface react with each other for example by mean of a voltage. A permanent bond is generated. This is used for example to hermetically seal microelectronic components or to connect electronic functions to mechanical ones.

SOI Bonder:
SOI (Silicon-on-Insulator) Bonders combine two special silicon wafers and thereby create a thin silicon layer on an insulating layer. So-called SOI wafers are produced.

Temporary Bonder:
The Temporary Bonder temporarily fixes fragile wafers to a so-called handle or carrier wafer in order to facilitate processing of very thin and fragile substrates.

Debonder:
When processing of the fragile wafer is finished, the Debonder separates the fragile wafers from the carriers, which were previously bonded in the temporary bonder.

Hot Embosser:
Hot Embossing is a technology to create nanoscale three-dimensional structures in thin material surfaces by using a stamping process. These structured materials are the basis for the production of microfluidic components for biomedical, biological or chemical sensors as well as optical components for data storage.

Integrated Systems:
Integrated systems combine the process steps of several single systems (for example align, expose, develop) into one fully automated process flow.

SOI Wafer:
SOI wafers are new starting materials for the electronic industry. They enable higher integration density and miniaturization of electronic circuits and data storage components. Application areas for SOI wafers are mobile phones, laptops with multimedia functions and microprocessors.

MEMS:
MEMS (microelectromechanical systems) are combinations between microelectronic devices like ICs (integrated circuits) and micromechanical, optical, chemical or biochemical components.

Advanced Packaging:
This is a technology for assembly, interconnecting and packaging the final processed wafers with ICs at wafer level using front end manufacturing processes like resist coating and photolithography.

Compound Semiconductors:
Are combined elements of silicon and other semiconductor materials which offer unique electrical properties. Advanced devices made of compound semiconductors are LEDs, Laser Diodes or radiofrequency devices for mobile phones or high-speed internet connections.