Advanced-chip-to-wafer technology (AC2W)

Our new advanced-chip-to-wafer technology (AC2W) has been developed in a joint R&D project with Datacon. It combines Datacon´s leading expertise in chip-bonding and key flip-chip bonding technologies with the unique wafer-level know-how from EV Group.

The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices, e.g. chips, under defined process conditions, after they have been fixed with a temporary fixing agent in a high-precision flip-chip bonder from Datacon. The technology used for the bonding process is called SOLID F2F, in which "SOLID" stands for solid liquid interdiffusion, a technology that uses a metal soldering process. F2F stands for face-to-face and describes the orientation of the two chips with their active side facing each other.

Advantages

• High device density through stacked devices and short interconnects
• Higher functional density through separation of embedded processes, through combination of different applications by stacking and multiple stacking
• Enables planar process
• Improved yield
• Covering KGD (known-good-die)

For more information please visit also www.datacon.at